MX-RPLPS
Mini ITX Motherboard, CPU + PCH Multichip Package, LGA 1700 socket supports Intel® Core™ Processor
I/O Features: USB Type C Thunderbolt® 4, 4xDP++, 2x2.5GbE LAN, 3xM.2, DDR5 5200MHz
Product SpecMini ITX Motherboard, CPU + PCH Multichip Package, LGA 1700 socket supports Intel® Core™ Processor
I/O Features: USB Type C Thunderbolt® 4, 4xDP++, 2x2.5GbE LAN, 3xM.2, DDR5 5200MHz
Product SpecIntel® Processor N97 quad-core, and 32GB eMMC onboard Fanless Embedded Computer
I/O Features: 1xCOM, 2xDP, 2xLAN, USB OTG, 3xUSB 3.2Gen2, Audio Combo Jack, 2xM.2
Product Spec13th Gen Intel® Core™ i7/i5/i3 Raptor Lake P Mobile CPU onboard, Compact Fanless Computer
I/O Features: USB Typc C Thunderbolt 4, 1xCOM, 2xDP, 2xLAN, 6xUSB, 3xM.2
Product SpecDual Sockets Server Motherboard support 5th Gen Intel® Xeon® Scalable Processors (formerly Emerald Rapids) up to 270W TDP
I/O Features: 12 DDR5 5600MHz RDIMM up to 3TB, 7 Gen5 PCIe x16 slots, 3 x Slim SAS, RAID 0, 1, 5, 10, IPMI 2.0
Product Spec12th Gen Intel® Processor N97, Quad-core, Fanless Operation, Low-profile, 3.5” SBC
I/O Features: 32GB eMMC Onboard, USB Typc-C OTG, 2xDP++, Dual 2.5GbE LAN, 7xUSB, 4xCOM, 12-24V DC-in
Product Spec13th Gen Intel® Core™ i7/i5/i3 Mobile Processor onboard, 3.5” SBC
I/O Features: USB Type C Thunderbolt 4, 2xDP++, Dual 2.5GbE LAN, 7xUSB, 4xCOM, 12-24V DC-in
Product SpecBCM is your one-stop-shop and trusted supplier for all of your embedded computing requirements. From turn-key ODM/OEM design, both x86 and ARM, to quality & ISO controlled manufacturing, call us to learn more about how we can support your embedded computing project(s).
Turn-key custom design for motherboard and system level. Intel®, NXP, and Rockchip ARM (RISC) platform. Design service criteria covers spec consultation, development, schematic design, layout, CAD drawing, mechanical & ID design, 3D modeling, mock-up plastic housing, tooling, mounting design, thermal simulation, and regulatory certifications. Best in class US-based Engineering Support, FAE Consultation, and Project Management teams able to provide same-day responses for North America customers through our California tech hub. Learn More
Our products are designed for 24/7 operation with a minimum lifecycle of 5-7+ years. To ensure long-life parts availability, BCM primarily designs products based on technology providers such as Intel® or NXP® that have a firm commitment to provide extended lifecycle chipsets and processors. BCM strives to provide 6 months advanced notification on any product changes especially related to component end-of-life (EOL) notifications and/or last-time buy options or suggested product replacements allowing for informed decisions.
Made in Taiwan. Quality - ISO 9000 & ISO 14001, ISO 13485 (Medical Electronics Device), and TS 16949 (Automotive Electronics) certified factories. Low RMA + No Production Line Disruption = Optimized Efficiency.
We partner with global, tier one, distributors and system integrators to best support for our ODM/OEM customers with seamless order placing, delivery, stocking, payment terms, and worldwide logistics.
Our Purchasing, Supply Chain, and Logistics experts are true veterans in the electronics industry. Their experience time again helps our customer to navigate and mitigate the consequences of severe components shortages, astronomical lead-times, port strikes, natural disasters, and many other calamities that drive costs up, push efficiencies down, and potentially lead to the worst case scenarios of lines-down. We can’t prevent industry chaos but we’ve seen it before and most definitely can help reduce its negative impact.
BCM has a team of professions that can help our customer with regulatory compliance and certifications for their OEM equipment that uses our products or services. We are experts in worldwide emission and safety certifications at both the PCBA and system level. We understand and comply with worldwide standards in hazardous material reporting and labeling requirements such as Reach, RoHS, conflict minerals or emissions and safety standards such as FCC, CE, UL, CSA, and IEEE.
Building on the success of the Sapphire Rapids series, Intel’s 5th Gen Xeon® Scalable Processor, codenamed Emerald Rapids, offers higher clock speeds, expanded caches, enhanced memory support, maximized core count per socket, and improved overall performance.
Read More..Looking for a Rugged and Reliable Alternative to Intel's NUC? BCM Offers Industrial-Grade NUCs for IoT and semi-industrial applications
Read More..BCM introduces ECM-RPLP, a cost effective, low power platform delivering features for performance(28W)/ modern (15W) thin and light IoT Edge and AI computing applications.
Read More..Discover the exceptional capabilities of the Intel® Tiger Lake UP3 Processor with Iris® Xe Graphics in a compact, feature-rich fanless NUC System
Read More..Offering Longevity, Security, Remote Management, System Compatibility, and of course High Performance
Read More..The MX610H Mini ITX motherboard is built with Intel® H610E PCH and the LGA1700 CPU socket which supports the 12th Gen Intel® Core™ i9/i7/i5/i3 processors and delivers scalable computing performance.
Read More..To meet the growing demand for IoT, AI, Edge Computing, and 5G applications, while saving our customers time and cost on development, the Intel® Developer Cloud program enables our customers to test drive our qualified products on the Intel® DevClound platform online.
Exhibition: October 8-10, 2024
The Venetian Expo, Las Vegas